Congratulations! The First Overseas Order of Xinmeng's High-End Equipment Has Been Successfully Shipped!
On May 14th, the fully automatic wafer-level electroless nickel-palladium-gold (ENEPIG) plating equipment independently developed by Jiangsu Xinmeng Semiconductor Equipment Co., Ltd. successfully completed assembly and testing and was officially shipped to overseas customers. This milestone marks a significant step forward in Jiangsu Xinmeng Semiconductor's internationalization strategy and demonstrates the growing global competitiveness of China's high-end semiconductor equipment manufacturing industry.
The shipped equipment is one of Jiangsu Xinmeng Semiconductor's core independently developed products — the fully automatic wafer-level ENEPIG plating equipment. Playing a crucial role in advanced semiconductor packaging, this equipment is mainly used for the surface treatment of wafer-level chips. By precisely controlling the electroless plating process of the three metal layers (nickel, palladium, and gold), it provides excellent solderability, electrical conductivity, and corrosion resistance for chip pads, thereby ensuring the long-term reliability and high-performance operation of chips.
Jiangsu Xinmeng Semiconductor Equipment Co., Ltd. is committed to providing comprehensive solutions for high-end wet process equipment and technologies in fields such as substrate manufacturing, integrated circuits (ICs), and advanced packaging. The company boasts a portfolio of core technologies with independent intellectual property rights, covering product lines including fully automatic single-wafer cleaning equipment, fully automatic FOUP cleaning equipment, fully automatic tank cleaning equipment, and the exported fully automatic wafer-level ENEPIG plating equipment. Leveraging its profound expertise in precision manufacturing and automated control, Jiangsu Xinmeng Semiconductor's equipment has gained wide recognition from domestic customers for its high efficiency, stability, and process accuracy. Previously, the company successfully developed and delivered China's first fully automatic ENEPIG plating equipment and China's first FOUP cleaning machine, among other advanced products.
Fully automatic wafer-level ENEPIG technology has become a key process in semiconductor packaging, especially for chip manufacturing in high-reliability application fields such as automotive electronics. It effectively protects wafer pads under high voltage and large current conditions, prevents "black pad" phenomena, adapts to more types of solders, and meets stricter reliability requirements. Jiangsu Xinmeng Semiconductor's successful launch of this equipment into the international market not only validates the advanced nature and maturity of its technology but also provides a new high-quality option for the global semiconductor industry chain.
Liao Zhoufang, General Manager of Jiangsu Xinmeng Semiconductor, stated: "The successful overseas shipment of the first fully automatic wafer-level ENEPIG plating equipment is a pivotal moment in the company's development history. It is not only an affirmation of our technical strength and product quality but also a firm commitment to actively expanding overseas markets and serving global customers. In the future, Xinmeng Semiconductor will continue to increase R&D investment, pursue continuous innovation, and strive to provide more high-quality, high-performance equipment solutions for the global semiconductor industry, contributing to enhancing the resilience and efficiency of China's and even the global semiconductor supply chain."